HEAT SINK COMPOUND
Non-returnable
Thermal paste, also known as heat sink compound or thermal interface material (TIM), is a substance used to improve the thermal conductivity and transfer of heat between two surfaces, typically the CPU (central processing unit) or GPU (graphics processing unit) and the heat sink.
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Product Details
High Thermal Conductivity: Efficiently conducts heat from the electronic component to the heat sink, minimizing overheating.
Low Thermal Resistance: Ensures minimal resistance to heat flow, improving the cooling efficiency.
Filling Gaps: Fills microscopic air gaps and imperfections between the heat sink and the component, ensuring better surface contact.
Non-Electrically Conductive: Many thermal pastes are designed to be non-conductive to avoid any risk of electrical shorts between components.
Long-Lasting: Designed to remain effective over long periods without drying out or losing performance